TIA welcomes 5 new board members
Arlington, VA (June 19, 2026) – The Telecommunications Industry Association (TIA)– enabling the future of trusted digital infrastructure, welcomes 5 new member to the organization’s Board of Directors:
- John Bozzetto, Vice President of Structural Engineering, Vertical Bridge
- Michelle Kang, PE Discipline Leader, Telecommunications, Colliers Engineering & Design
- Scott Kisting, Executive Vice President, Proactive Telecommunications Solutions, LLC and Vice President Congruex
- Justin T. Kline, Vice President, Paul J. Ford & Company
- John Kuzin, Senior Vice President, Spectrum Policy and Regulatory Counsel, Qualcomm
“TIA’s Board reflects the full breadth of the digital infrastructure ecosystem, and we are pleased to welcome five new members whose leadership spans both the wireless sector and semiconductor innovation. Their combined expertise—from advancing next-generation wireless networks to enabling the chips that power them—strengthens that foundation and will help us advance global standards, foster industry collaboration, and enable secure, reliable connectivity at scale.” said TIA CEO Dave Stehlin.
A full list of the new 2026 TIA Board of Directors and Executive Committee can be found online here.
Contact
ushahs@tiaonline.org
About TIA
The Telecommunications Industry Association (TIA) advances trusted digital infrastructure for a connected world. Representing more than 400 companies globally, TIA brings industry and government together through standards development, government advocacy, certifications, and industry programs to support resilient, innovative infrastructure. Accredited by the American National Standards Institute (ANSI), TIA plays a central role in shaping the future of global digital infrastructure.